At Photronics, there are two proprietary processes by which binary COG masks are manufactured: NanoRange, and UltraRes. UltraRes masks are built on e-beam platforms used primarily for resolving very small mask main and OPC features. Using a 50KeV e-beam and chemically amplified resist (CAR), Photronics is able to build the smallest, most intricate designs ever requested. NanoRange masks are built on a laser platform and are aimed at providing a lower cost solution focusing on CD uniformity above other specification parameters. Regardless of the writing strategy, Photronics stands behind its promise to deliver the highest quality device images ready to serve as master patterns for its lithography customers.

Phase shifting mask (PSM) techniques are here to stay as well, and Photronics covers both technology strategies to meet all requests. The ePhase PSM family utilizes a wavelength-tuned, 6% transmission MoSiON absorber for both 248nm and 193nm wafer exposure systems. In addition, pattern fidelity is superior thanks to the use of the NanoRange and UltraRes processes used to define the top chrome layer. Once defined by these SRS binary processes, the chrome layer serves as the pattern for the MoSiON below it by means of an inductively coupled plasma (ICP) etch process. The glass trench PSM technique, tPhase, is offered by Photronics in several varieties. Whether a customer needs a single trench, dual trench, three-phased terrace design, or even chromeless phase lithography (CPL), the tPhase process is flexible enough to deliver the lithographic results desired.

Photronics continues to receive pertinent and timely inputs to direct its current research and development programs. Our three-year relationship with Corning keeps us abreast of new developments in fused silica substrate research. Our joint projects and publications with MIT-Lincoln Labs, the Rochester Institute of Technology, and ASML-MaskTools help steer our PSM materials and layout strategy. Being the primary supplier to IMEC, the world's leading lithography research consortium in Belgium, has allowed us to stay at the forefront of reticle enhancement technique (RET) innovations. For that matter, being the primary supplier to wafer scanner, inspection & metrology, and reticle standards groups keeps us ahead of the curve in the areas of feature resolution and control.

At the extreme high end, Photronics is currently transferring the know-how it gained from running the IBM Mask Center of Competency (MCoC) lab for the last three years. Extreme ultraviolet (EUV) capability is in the early stages of becoming reality-a capability that stands to carry the industry below the 50nm barrier. Photronics made the commitment to incorporate next generation lithography (NGL) technology over three years ago, and is on the cusp of realizing the fruits of that endeavor. Add to all this the early qualification work we have already completed in other fields of technology-advancing fields such as photonics, thin film heads, gray scale imaging, etc. When the use of photomasks become mainstream in the manufacture of these products, Photronics will already have the technological infrastructure in place to meet aggressive industry ramp schedules.

Additionally, Photronics is presently equipped and ready to meet the demands of our most technologically advanced customers across a wide range of product types. Photronics' dedication to technology has never been stronger. As future technological challenges continue to present themselves, the bright and talented Photronics team of technologists is committed to keeping that momentum and focus to turn those challenges into opportunities.